Structural substantiation of wafer fabrication
equipments
- Concept designs, detailed design, FEA and CFD
analysis of Plasma etch chambers and its equipment,
Wafer cleaning process equipment and Dielectric etch
process chambers.
- Thermal/structural analysis
- Random vibration analysis
- Fatigue life calculation and creep analysis of
plasma chambers
- Fracture mechanics analysis to predict crack
propagation and life.
Electronics cooling Engineering
- System level design and FEA/CFD based analysis of
Entertainment devices, laptops, cell phones, chassis
design and optimization, and many more
- Package level design and FEA/CFD analysis for
integrated Chip sets, PCB boards, mother boards,
graphics cards, etc
- Micro level design and FEA/CFD analysis (BGA solder
balls and solder bumps)
Reliability Engineering using FEA approach
- To predict the life or root cause failure analysis
of BGA Solder Balls and solder bumps using visco-plastic
FEA analysis approach in consideration of Creep strain
accumulation and thermal gradient effects. It can be
achieved by doing Creep analysis based on field
operating conditions and life is calculated based on the
Fatigue life equations (Darveaux method)
- Delimitation and adhesive bonding strength analysis
of composites
- Temperature mini cycling tests
- Drop tests / Crash and Shock tests of integrated
chip sets, PCB boards- Explicit approach
- Random Vibration analysis
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